VIGON® UC 160 Water-Based Stencil Cleaning Solution

VIGON® UC 160
Aqueous stencil bottom wiping cleaner with high wettability
Flux cleaner
VIGON® UC 160 is specially designed for aqueous cleaning of stencil bottom wiping in SMT printers. VIGON® UC 160 possesses exceptional wetting capability, resulting in more effective cleaning and significantly reducing solder paste contamination on the stencil bottom. By performing stencil bottom wiping, it prevents solder paste bridging during printing, thereby ensuring optimal printing results.

Advantages compared to other cleaners:

Even for fine apertures, VIGON® UC 160 effectively removes various new types of lead-free and leaded solder pastes during bottom wiping
VIGON® UC 160 is particularly suitable for intermittent printing
With its superior wetting ability, VIGON® UC 160 delivers outstanding cleaning performance, markedly reducing solder paste contamination on the stencil bottom and preventing bridging during printing
Stable wiping shape ensures reduced solder ball formation
Excellent safety and health characteristics (e.g., no flash point, low VOC values), making it an ideal replacement for isopropyl alcohol (IPA) or alcohols
Mild odor
Applications
Contaminant removal
Cleaning processes
Cleaning technology
Printer bottom wiping
Download technical documentation

Shenzhen Junji Ruixiang Technology Co., Ltd.

Mr. Zeng 13902983965 (same number for WeChat)

Email: zengken@sz-cksc.com

Website: www.sz-cksc.com

Address: Room 1807, Oriental Plaza, Jianshe Road, Nanhu Street, Luohu District, Shenzhen